We design the best heat dissipation solutions, specific to your application.
Baknor uses a number of cooling technologies
(Natural Convection, Forced Air, Phase Change, Liquid Cooling)
that can be adapted to meet almost any application in any industry.
Our products are custom designed to provide you the most suitable solution for your demanding application.
BRING US YOUR TOUGHEST THERMAL APPLICATION CHALLENGE
Use Our Design Services or Send Us Your CAD Drawings
This information will allow us to respond quickly in addition to ensuring we are clear on what is required for your specific application. The checklist will help expedite the design process and ensure accurate thermal simulation.
The variables that will be important to understand such as general variables + specific heat transfer variables can be categorized into three priorities.
This list of information is not a comprehensive list. It is only meant to guide the conversation. Once we have had an opportunity to review what you have provided, we suggest a conference call to review and take any next steps.
Required
Absolute bare minimum needed to run a simulation. Results with the bare minimum may produce unusable results.
Important
When this information is included, it will allow us to obtain a relatively accurate simulation result.
Minor
Although this information may be negligible, it will improve simulation accuracy.
General Information Required for “Natural Convection”
Required
1. Dissipation Power of the Heat Source.
2. Order Volume. Different volumes may warrant different manufacturing techniques that will change the design. The priority of these general inquiry parameters depend on which specific cooling method we determine.
3. Ambient Temperature.
4. Orientation of Heat Sink. Performance can vary up to 20% depending on orientation
Important
Important
5. Size/ footprint of the heat source. Example: Area of the mating surface. Assume uniform heating across entire mating surface of the heatsink.
6. Mounting hole locations. Not essential for thermal simulation.
7. Maximum allowable temperature. Defined in two ways: maximum temperature of the heat source (°C) or thermal resistance (°C/W). Assume 80°C maximum temperature.
Minor
8. Size limitations. Assume reasonable limitations based on the size of the heat source
Required
1. Dissipation Power of the Heat Source.
2. Order Volume. Different volumes may warrant different manufacturing techniques that will change the design. The priority of these general inquiry parameters depend on which specific cooling method we determine.
3. Air flow rate. Defined as the volume of air being moved, typically defined in CFM. Ideally specify a fan model that includes data such as a fan curve, hub diameter, rotor speed etc. as flow rate changes with back pressure
4. Source, Location and Direction of Air Flow.
Important
5. Enclosure geometry. Defined as the structure that encapsulates the heatsink and any potential objects (e.g. large components) that could block any airflow towards the heatsink. Otherwise assume no objects obstructing flow and no enclosure.
6. Size/ footprint of the heat source. Example: Area of the mating surface. Assume uniform heating across entire mating surface of the heatsink.
7. Mounting hole locations. Not essential for thermal simulation with exception for liquid cooling designs
8. Maximum allowable temperature. Defined in two ways: maximum temperature of the heat source (°C) or thermal resistance (°C/W). Assume 80°C maximum temperature.
Minor
9.Size limitations. Assume reasonable limitations based on the size of the heat source
10. Ambient temperature. Assume room temperature
Required
1. Dissipation Power of the Heat Source.
2. Order Volume. Different volumes may warrant different manufacturing techniques that will change the design. The priority of these general inquiry parameters depends on which specific cooling method we determine.
3. Heat Source Footprint. Size, footprint of the heat source - Example - area of the mating surface. Assume uniform heating across entire mating surface of the heatsink.
4. Mounting hole locations. Coolant channel may need to be designed around the mounting holes.
Important
5. Coolant inlet / outlet connection type and locations. E.g. barbed, press fit, welded, threaded connection...on opposite/same side.
6. Coolant inlet temperature. Defined as temperature of the coolant at the entrance of the cold plate. Assume room temperature.
7. Leak Testing Pressure
8. Materials Required. Copper, aluminum, stainless steel, etc.
9. Type of Coolant. Example - water, refrigerant, etc. Assume water.
10. Maximum allowable temperature - Defined in two ways: maximum temperature of the heat source (°C) or thermal resistance (°C/W). Assume 80°C maximum temperature.
Minor
11. Size limitations. Assume reasonable limitations based on the size of the heat source.
12. Ambient temperature. Assume room temperature.
13. Maximum allowable pressure drop. Defined as difference in pressure between the inlet and outlet, or resistant flow experiences. Assume reasonable pressure drop based on performance requirement.
14. Coolant Flow Rate. Can be assumed based on heat dissipation load.
BRING US YOUR TOUGHEST THERMAL APPLICATION CHALLENGE
Use Our Design Services or Send Us Your CAD Drawings
Start the conversation with our thermal design solution professionals, by using our thermal design check list, to analyze and solve your thermal challenges.
5225 Orbitor Drive Suite 2
Mississauga, Ontario Canada, L4W 4Y8
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