Extruded Liquid Cold PlateToDissipate Heat From Power Electronics
IBGT Liquid Cold Plate Using Aluminum Extrusions
Liquid Cold Plate With Aluminum Extrusions and Deep Holes
Extruded Liquid Cold Plate
Baknor designs thermal solutions to meet our customer’s specific application using cutting-edge manufacturing techniques. Our extensive knowledge of cooling weighs various tradeoffs and factors such as performance, manufacturability, volume, mass, cost, packaging, efficiency, functionality and the reliability and safety of heat dissipation components.
Liquid-cooled cold plates are commonly used for high heat flux or high-power electronics cooling applications. Extruded Channel Liquid Cold Plates are an ideal solution for many types of application such as high power IGBTs. They are a less expensive than machined cold plate offerings. Aluminum extruded cold plates typically have end caps that can be brazed or friction stir welded on to the channels. This offers a very robust solution that is hermetically sealed. The end caps will have inlet and outlet connections attached. Heat from the device(s) is transferred to a single-phase liquid coolant, circulating through internal channels of the plate and subsequently rejected downstream to a radiator.
Using extrusions to create channels for the liquid flow or fins to act as a radiator, are one of several processes that enable us to provide the right solution to control costs from low to high volume, maintain exceptional quality, and give customers the best performance for their most challenging thermal projects.
Our thermal designs ensure the optimum temperature to keep a device running efficiently while improving performance essential for today’s electronic designs.
They are perfect for a variety of different applications which include dissipating watts to many kilowatts, such as: power inverters, DC-DC converters, wind inverters, solar inverters, automotive, hybrid and electric vehicles, MRI amplifiers, power supplies, variable speed drives, locomotive, traction drives, agriculture machinery, lasers, RF amplifiers, data centre, CPU, GPU, and chillers and many more. Many of these applications are able to take advantage of the minimized weight in addition to being able to use both sides of the cold plate to cool.