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ALUMINUM BACKED METAL CORE PRINTED CIRCUIT BOARDS, are widely used in LED and other advanced technologies to aid in heat dissipation and allow specific illumination. In each, a thin layer of thermally conductive but electrically insulating dielectric material is laminated between a metal base and a copper foil. This is then etched into the preferred circuit pattern while the metal base draws heat away from the circuit through the thin dielectric layer.

Also referred to

Aluminum Clad,

Aluminum Base,

Thermally Conductive PCBs,

IMS (Insulated Metal Substrate),

MCPCB (Metal Clad Printed Circuit Board).

Benefits over FR-4 PCBs

- Improved Reliability.

- Mechanically Rigid.

- Increased Life and Durabilty.

- Improved Thermal Conduction.

- Reduce Heat Sink Requirements.

- Reduce Component Temperatures.

- Potential To Reduce PCB Dimensions.

- Excellent EMI-EMC Shielding Characteristics.

- Increased Physical Strength Of The Assembly.

- Versatility In Component And Tracking Layout.

- Reducing The Thermal Stress On All Components



Base metals are used as an alternative to FR4 or CEM3 boards for the ability to dissipate heat away from critical board components and to less crucial areas such as the metal heat sink backing or metallic core technologies. The dielectrics used are typically 5 to 10 times as thermally conductive as conventional epoxy-glass and a tenth of the thickness resulting in thermal transfer exponentially more efficient than a conventional rigid PCB. This is so effective that lower copper weights than suggested by the IPC heat-rise charts can be used.

The metal core of the thermal PCB can be aluminum (aluminum clad PCB), copper (copper clad PCB or a heavy copper PCB) or a mixture of special alloys. The most commonly used is an aluminum clad PCB.

Metal core or IMS (Insulated Metallic Substrate) circuit boards are an excellent alternative to standard circuit boards, if the circuit boards are exposed to large mechanical loads, or a high level of dimensional stability is required, or high temperatures must be conducted away from power components or LED's.

The thermal conductivity assisted by the aluminum cores in the circuit boards makes higher packing densities, longer operating times, and improved security against failure possible, such as for LED technology and for high power transistors.

Aluminum Backed PCB with LED Mounted

Allows For Higher Packing Densities

Provides For Longer Operating Times

Expect High Reliability Against Possible Failure

Bendable Aluminum Printed Circuit Boards

Bendable Aluminum PCB Meets The Following:

IPC Peel Strength, Dielectric Breakdown and Thermal Impedance

60 & 90-Degree Radius

Variety of surface finish

Super bright solder mask

Copper 5052, 6060, 6061

Very good heat dissipation

Copper Thickness 35-180 um

UL approved and RoHS compliant

Thermal Conductivity 1.0-3.0 w/mK

Bendable Aluminum Printed Circuit Boards
Bendable Aluminum Printed Circuit Boards

Mirror Face Aluminum Printed Circuit Boards

Mirror Face Aluminum Printed Circuit Boards

Mirror Face Aluminum Printed Circuit Boards

Integrated Mirror Backing

Plus Super White Solder Mask

Provides Up To 96% Reflectivity

Design Consideration For Metal Core PCBs


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