Heatsinks • Liquid Cold Plates • Heatpipes • Vapor Chambers
Thermal Solutions Built for OCP & Open19 Rack Power Demands
Custom thermal hardware for CPUs, GPUs, memory, power, I/O, SSDs and
power distribution in AI-class data centres..
Designed for high-density racks - Engineered for AI workloads - Prototype to production
Why Air Alone Fails at These Densities
AI, GPU and CPU loads push racks well beyond what air cooling can handle. As power rises and space tightens, airflow paths collapse, hot spots multiply, and throttling becomes the norm. Traditional heatsinks and fans can’t keep up with OCP and Open19 rack densities.
The answer is a stack of liquid, phase-change and advanced conduction solutions that manage heat at the module level while fitting real-world OCP/Open19 mechanical envelopes.
Baknor’s Thermal Stack for OCP & Open19
Four core technologies, combined in different ways, to keep every critical module inside its thermal limits.
Heatsinks
Extruded, machined and bonded-fin designs for areas where air or hybrid liquid cooling is still practical.
Liquid Cold Plates
Direct-to-chip and module-level plates for CPUs, GPUs, PSUs, high-speed I/O, SSD modules and PDUs.
Phase Change Solutions
Heat Pipes and Vapor Chambers to move heat away from tight footprints inside OCP & Open19 envelopes.
Forced Convection
Handle high local heat flux and spread heat evenly before it’s removed by fins or liquid cold plates.
Thermal Solutions by OCP & Open19 Module
Targeted cooling hardware for each module type in the rack—from CPUs and GPUs to SSDs and power distribution.
CPU Modules
High-core-count CPUs in tight envelopes.
- Vapor-chamber bases with fin stacks
- Direct-to-chip cold plates
- Hybrid conduction and cold-plate assemblies
GPU / AI Accelerators
High-TDP GPUs and AI accelerators.
- High-flow cold plates
- Vapor chambers for die spreading
- Manifold-ready mounting designs
Memory Modules
Dense DIMMs and memory clusters.
- Compact heatsinks
- Shared cold plate bridges
- Heatpipe-assisted spreading
Power Supply Modules
PSUs and rectifier bricks under continuous load.
- Cold plates for MOSFETs and transformers
- Heatpipe-embedded baseplates
- High-surface-area fin designs
High-Speed Data I/O
OSFP, QSFP and other high-speed modules.
- Compact vapor chambers
- Micro cold plates
- Low-profile heatsinks
Solid-State Drive Modules
SSD modules under sustained writes.
- Thin vapor chambers
- Conduction plates
- Side-mounted heatpipe sinks
Power Distribution Units
Busbars and conversion modules.
- Cold plates for power electronics
- Heatpipe spreaders
- Hybrid fin-stack assemblies
Lets Start The Conversation
Download Our Thermal Design Checklist
Thermal Solutions Built for OCP
& Open19 Rack Power Demand
The checklist is designed to speed up the design workflow and improve the accuracy of thermal simulations. It identifies the key variables required, from general design parameters to specialized heat-transfer inputs. Each item is organized in a colour-coded format, grouped into three priority levels for clarity and efficiency.
Designed Around OCP & Open19 Requirements
Every design starts with the real constraints of your racks: mechanical envelopes, connector clearances, manifold routing, quick disconnects and service access. We weigh the trade-offs between thermal performance, pressure drop, weight, cost and manufacturability to arrive at a solution that your team can actually build and operate at scale.
Manufacturability & Reliability Built In
Design for Manufacturability
Channel geometry, sealing methods, materials and tolerances are chosen for efficient, repeatable volume production.
Controlled Pressure Drop
Flow paths are engineered to balance thermal performance with realistic pump head and system-level constraints.
Proven Reliability
Flatness, leak, thermal and mechanical testing form part of every production program, from prototype to scale-up.
Start an OCP/Open19 Thermal Design Review
Share your rack power map, module list or mechanical envelopes, and we’ll come back with a concrete thermal approach.