Standard Liquid Cold Plates For IGBTs

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Standard Liquid Cold Plates For IGBTs

When cooling IGBT modules and high-powered semiconductors, air cooling may not be able to dissipate the heat required. This is when designers turn to liquid cold plates. It is a way to implement localized cooling of power electronics by transferring heat from the device to a liquid that flows to a remote heat exchanger and dissipates into either the ambient or to another liquid in a secondary cooling system.

Baknor liquid cold plates are the right choice for cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components, medical equipment, and any application where liquid cooling is needed.

Designed as a standard product, our cold-plates meet standard IGBT power module foot prints manufactured by Mitsubishi, Infineon, Semikron SemiTrans, Fuji Semiconductor and Microsemi . The cold-plates are compatible with standard cooling fluids used in most applications, including etylene glycol and water solutions (EGW), dielectric fluids such as Flourinert™ and oils.

Baknor Part Number Industry Compatible Power Module Packages

BK CP1421

  • Fuji Semiconductor M127; M234; M235
  • Infineon 62mm Package
  • Microsemi SP6, D3 and D4 Packages
  • Mitsubishi 62mm Package
  • Semikron SemiTrans ® Case D56

BK CP1426

  • Fuji Semiconductor M238 & M247
  • Mitsubishi IGBTMOD™ A, NF & NFH Serie

BP CP1518

  • Fuji Semiconductor M629
  • Infineon EconoPACK™ +
  • Mitsubishi Intellimod™L Series
  • Semikron SEMIX® 33

BP CP1521

  • Fuji 122 X 62MM Package
  • Infineon EconoDUAL™ 3
  • Mitsubishi IGBTMOD™ A & NX SERIES
  • Semikron SEMIX® 3


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