When cooling IGBT modules and high-powered semiconductors, air cooling may not be able to dissipate the heat required. This is when designers turn to liquid cold plates. It is a way to implement localized cooling of power electronics by transferring heat from the device to a liquid that flows to a remote heat exchanger and dissipates into either the ambient or to another liquid in a secondary cooling system.
Baknor liquid cold plates are the right choice for cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components, medical equipment, and any application where liquid cooling is needed.
Designed as a standard product, our cold-plates meet standard IGBT power module foot prints manufactured by Mitsubishi, Infineon, Semikron SemiTrans, Fuji Semiconductor and Microsemi . The cold-plates are compatible with standard cooling fluids used in most applications, including etylene glycol and water solutions (EGW), dielectric fluids such as Flourinert™ and oils.