With our success in heat sink design and thermal management experience with customers around the world, you can rely on Baknor for innovative cooling solutions and custom metal fabrication for the electronic industry. Our outstanding engineers have special expertise in thermal and packaging technology that gets you to market with the best solutions possible.

We specialize in thermal management and custom metal fabricated solutions for the electronics industry:

Build to print from your existing drawings. Custom thermal and electro mechanical assemblies.

Engineering, turnkey thermal designs, simulations and consulting. Custom heat sink & cold plate design, prototyping and manufacturing.

Custom metal fabrication from extrusions, machining, forging, castings. Manufacturing for thermal product line & custom metal fabrication.

Cut costs with Baknor

Baknor offers high quality solutions, frequently at much lower costs than other manufacturers.

If you are looking for cost reductions for heat sinks, cold plates, thermal assemblies or various electro mechanical components and assemblies made from extrusions, machining, forging or castings, send us your drawings to start the evaluation process on what we can do for you.

We may also be able to reduce your costs through redesign or using a different manufacturing process.

Many customers who are buying off the shelf components, may be able to reduce their costs, by having us develop a custom version for you.

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Thermal Management Solutions - Design, Analysis, Simulation, Manufacturing

Fabricated and Laminated Busbars - Design, Analysis, Simulation, Manufacturing

Custom Metal Fabrication - Take Advantage Of Baknor’s Custom Metal Fabrication. Being globally cost competitive in the thermal management product area has also allowed us to help customers consolidate their vendor base for custom metal fabrication. This also includes various finishes even when cosmetics are critical.

Electromechanical Assemblies - Thermal assemblies involve the complex integration of various technologies, such as fans, heat pipes, vapour chambers or thermal interfaces materials to provide a complete high performance thermal solution. Through the effective integration of various technologies, thermal assemblies can be optimised to reduce overall weight, improving thermal conduction paths and improve thermal efficiency.

Aluminum Backed Metal Core Printed Circuit Boards - The thermal conductivity assisted by the aluminium cores in the circuit boards makes higher packing densities, longer operating times, and improved security against failure possible, such as for LED technology and for high power transistors.

Heat Dissipation Using Graphene Film Composites - We have created a graphene film heat sink that combines carbon nano tubes, graphene, and diamond dust which enables it to work extremely well for thermal dissipation.

Custom Designed Heat Dissipation Solutions By Baknor

Or We Can Collaborate On Your Design

or Let Us Manufacturer Your Design, Just Send Your CAD Drawings

sales@baknor.com

Are you are under pressure to get your designs to prototyping and production quickly?
But more importantly the design requires the smallest, lightest, fastest and be the most cost effective!
Then let Baknor’s extensive knowledge of COOLING SYSTEMS weighs various trade-offs and factors, help you get there fast.
Factors such as functionality, manufacturability volume, mass, cost, packaging, efficiency, reliability and safety of the heat dissipation for each component.

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Baknor The Way To Cool

Custom Designed Heat Dissipation Solutions By Baknor

Or We Can Collaborate On Your Design

or Let Us Manufacturer Your Design, Just Send Your CAD Drawings

sales@baknor.com