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Customer demands continue to evolve. Requirements for higher power solutions, smaller footprints, increases in power density, and need for more functionality per square inch are all issues that device and system developers must overcome in today's world Baknor Thermal Design Solutions help engineers design, simulate and validate complex, and high-performance thermal management issues. With the advent of finer IC architecture, demand for higher power devices, and more complex ICs, power dissipation variations can vary significantly.
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