Standard Vacuum Brazed Cold Plates | Baknor

STANDARD VACUUM BRAZED COLD PLATES

Detail 1

Vacuum brazing is a materials joining technique that offers significant advantages:

  • Extremely Clean, Superior,
  • Flux-free Braze Joints of High Integrity and Strength.
  • Channels: milled or offset lancet fins
  • Al base and stainless steel tubes

Vacuum brazing is suitable for electrically isolated devices in some traction and power transmission applications. This LCP is best suited for pure water in high voltage applications.

Standard Liquid Cold Plates

Suitable for any High Power
Semiconductor Applications



Advantages:

  • Compact
  • Light
  • Efficient
  • Safe & Reliable
Selection Guide and Datasheets
Detail 2
Part # Size Weight Efficiency
BK CP1421 140 x 210 x 18.5 mm 1.30 kg (Rth = 10 °C/kw @ 51/min)
BK CP1426 140 x 260 x 18.5 mm 1.60 kg (Rth = 8 °C/kw @ 51/min)
BP CP1518 150 x 180 x 18.5 mm 1.10 kg (Rth = 10 °C/kw @ 51/min)
BP CP1521 150 x 210 x 18.5 mm 1.35 kg (Rth = 10 °C/kw @ 51/min)
Detail 3

Part #

Compatible Power Modules

BK CP1421 Fuji Semiconductor M127; M234; M235
Infineon 62mm Package
Microsemi SP6, D3 and D4 Packages
Mitsubishi 62mm Package
Semikron SemiTrans ® Case D56
BK CP1426 Fuji Semiconductor M238 & M247
Mitsubishi IGBTMOD™ A, NF & NFH S
BK CP1518 Fuji Semiconductor M629
Infineon EconoPACK™ +
Mitsubishi Intellimod™L Series
Semikron SEMIX® 33
BK CP1521 Fuji 122 X 62MM Package
Infineon EconoDUAL™ 3
Mitsubishi IGBTMOD™ A & NX SERIES
Semikron SEMIX® 3